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Shenzhen International MIM & AM Technology Summit headlines Formnext + PM South China

发布时间:2020-04-01     作者:管理员     浏览:4534     字号:    

Formnext + PM South China is a professional event for additive manufacturing, powder metallurgy and advanced ceramics. Jointly organised by Guangzhou Guangya Messe Frankfurt Co Ltd and Uniris Exhibition Shanghai Co Ltd, the fair will be held from September 9th – 11th 2020 at the Shenzhen World Exhibition and Convention Center to showcase the latest offerings in the additive manufacturing and powder metallurgy industry.


Acting as a prelude to the first edition of Formnext + PM South China, the Shenzhen International MIM & Additive Manufacturing Technology Summit and a press conference were held today in Shenzhen to advocate the importance and advantages of the new fair to the industry, and provide an insight into the expected highlights of the upcoming show. Speaking  on the first edition at the press conference, Mr Louis Leung, Deputy General Manager of Guangzhou Guangya Messe Frankfurt Co Ltd and Ms Xiuping Han, Board Member of Uniris Exhibition Shanghai Co Ltd both expressed confidence that Formnext + PM South China can answer the needs of the ever progressing Chinese manufacturing industry, which will be beneficial to all players within the additive manufacturing and powder metallurgy industry.


In addition, Ms Petra Haarburger, President of Mesago and Mr Sascha F. Wenzler, Vice President and responsible for Formnext also spoke at the press conference to express their enthusiasm and expectations about the new show in Shenzhen.


Shenzhen International MIM & Additive Manufacturing Technology Summit offers the latest market intelligence and possibilities


Held alongside the press conference was the Shenzhen International MIM & Additive Manufacturing Technology Summit, arranged by the organisers of Formnext + PM South China and the China Powder Metallurgy Alliance (CPMA). A total of 12 presentations were conducted and two round table meetings were held, with over 350 attendees. The summit invited numerous domestic and international industry leaders and manufacturing experts to share their experiences and visions on some of the most innovative applications and solutions for additive manufacturing, powder metallurgy and advanced ceramics.


The aim of the summit was to identify the technical needs during the production process for the automobile, home appliance and communication industries, while facilitating the development and popularity of additive manufacturing technologies and advanced materials in the Chinese market. Some of the renowned speakers and their presentation topics included:


Topic: Low-cost Production Processes of Metal Powder for 3D Printing and MIM

Presented by: Prof Lin Zhang, Institute for Advanced Materials and Technology, University of Science and Technology Beijing

Topic: Implementing Automotive Parts Additive Manufacturing Processes with Industry 4.0 Technologies and Solutions

Presented by: Mr Bocheng Zhang, Siemens Ltd (China)

Topic: Connecting with Industry 4.0: How Can Traditional Manufacturers Incorporate 3D Printing Technologies

Presented by: Ms Kim Francois, Materialise China

Topic: 3D Printing Applications in Consumer Electronics

Presented by: Mr Heyuan Huang, Guangzhou HeyGears Intelligent Manufacturing Center Co Ltd

Topic: Industrial Application of Open Source Additive Manufacturing in Automotive Industry

Presented by: Mr Jing Tang, Shenzhen Farsoon 3D Printing Co Ltd

Topic: What are the Opportunities for MIM products in the 5G Era

Presented by: Dr Yaohong Qiu, You Need Technology Consultation Company

Topic: Metal Additive Manufacturing Applications in Automotive

Presented by: Mr Jia Wenyuan, Xi'an Bright Laser Technologies Ltd

Other outstanding companies who spoke at the summit included BASF (China) Co Ltd, China HP Co Ltd, Hunan Injection High Technology Co Ltd, Shenzhen Silver Basis Technology Co Ltd and SLM Solutions (Shanghai) Co Ltd.


The summit was widely supported by a number of leading brands in the industry who attended the event. They included ABB Engineering, EVA, FAW-Volkswagen, FIYTA, Flex, Foxconn, Geely Auto, GREE, Haojue, Honda, Jabil Circuit, Jabil Green point, Liangying Electronics, Midea, Nissan, Shanghai Aircraft Manufacturing, SIIX Electronics, TK Group, Unipres, vivo and more.


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